Shenzhen Sanligao Technology Co., Ltd.

Conductive Silver Paste Adhesive – High Conductivity and Reliable Bonding for Modern Electronics With the rapid development of the electronics, semiconductor, and new energy industries , manufacturers demand materials that can provide excellent conductivity, strong adhesion, and simplified processing . Traditional soldering or conductive inks often fail to meet the requirements of fine-line, low-temperature, and flexible bonding applications . The Conductive Silver Paste Adhesive is an advanced bonding material that combines metallic conductivity with polymer flexibility . It ensures stable electrical performance, excellent adhesion, and process versatility , making it an ideal alternative to traditional conductive solder or epoxy systems. Product Features and Advantages Excellent Electrical Conductivity Formulated with ultra-fine silver particles , this adhesive achieves low resistivity (<1×10⁻⁴ Ω·cm) , ensuring reliable and continuous current flow even in microelectronic circu...

Electrically Conductive UV Adhesive – Fast Curing and Reliable Conductivity for Advanced Electronics As electronic devices become smaller, faster, and more complex, traditional soldering and conductive epoxies often struggle to keep up with the demands of modern manufacturing. High precision, low-temperature processing, and rapid assembly have become essential in semiconductors, sensors, and flexible circuits . The Electrically Conductive UV Adhesive is designed to meet these advanced requirements. It offers strong electrical conductivity, rapid UV curing, and reliable mechanical bonding —all in one product. This next-generation conductive adhesive replaces traditional soldering in delicate or heat-sensitive applications, ensuring high performance, process efficiency, and long-term stability . Product Features and Advantages Superior Electrical Conductivity Formulated with high-purity silver or carbon fillers , the adhesive provides low volume resistivity (<10⁻⁴ Ω·cm) and ensur...

Medical Grade Adhesive for Devices – Safe, Reliable Bonding for Critical Healthcare Applications In the medical device industry, where precision, safety, and biocompatibility are non-negotiable, the choice of adhesive plays a critical role in ensuring the performance and reliability of medical equipment. From wearable sensors to surgical tools and diagnostic instruments, every bond must meet strict medical safety standards while maintaining mechanical durability and chemical resistance . The Medical Grade Adhesive for Devices is specially formulated to satisfy the demanding needs of medical OEM manufacturers . It delivers strong, reliable, and biocompatible bonding for plastics, metals, glass, and ceramics, ensuring stable performance in sterilization, chemical exposure, and physiological environments. It is fully compliant with ISO 10993 and USP Class VI standards, making it a trusted solution for critical healthcare assemblies . Product Features and Advantages Medical-Grade B...

Cyanoacrylate Instant Adhesive Industrial – Fast, Reliable Bonding for Precision Manufacturing In modern industrial assembly and manufacturing, speed and reliability are everything. From electronic components to automotive assemblies , cyanoacrylate instant adhesives —commonly known as “super glues”—have become an indispensable tool for achieving strong, rapid, and precise bonding across a wide range of materials. The Industrial-Grade Cyanoacrylate Instant Adhesive is specially formulated to meet the rigorous demands of high-performance manufacturing. Unlike consumer-grade glues, this adhesive delivers superior bonding strength, heat resistance, and long-term durability while maintaining extremely fast curing characteristics. It is the preferred solution for electronic assembly, precision machinery, medical device production, and plastic-metal bonding . Product Features and Advantages Ultra-Fast Curing Bonds instantly within 2–10 seconds , allowing high-throughput production and...

Edgebond Repairable Black Adhesive – Reinforcement and Reworkability for High-Reliability Electronics In the age of miniaturized, high-performance electronics, ensuring mechanical stability and reworkability in chip assemblies has become increasingly critical. Edgebond adhesives play a vital role in strengthening solder joints and protecting components such as BGA (Ball Grid Array) and CSP (Chip Scale Package) devices against shock, vibration, and thermal stress. However, traditional edgebond adhesives often present a major drawback — they cannot be repaired or removed after curing , which limits flexibility during assembly and maintenance. The Edgebond Repairable Black Adhesive was specifically engineered to overcome this limitation. It combines strong reinforcement with controlled reworkability , enabling easy chip removal and reattachment without damaging the PCB or solder balls. It’s the perfect choice for smart devices, automotive electronics, communication modules, and indu...

Rework Underfill Adhesive for Chips – Reliable Protection and Easy Rework for Advanced Electronics With the continuous miniaturization and integration of semiconductor packaging, chip-level reliability has become a key concern in modern electronics. Underfill adhesives are critical for protecting chips from mechanical stress, thermal cycling, and vibration . However, traditional underfill materials often make rework difficult or impossible once cured, leading to high repair costs and material waste. The Rework Underfill Adhesive for Chips is designed to solve this problem. It offers strong reinforcement, excellent thermal cycling resistance, and controlled removability , allowing rework and component replacement without damaging the PCB or chip. It is the ideal solution for BGA, CSP, and flip-chip assemblies in consumer electronics, automotive electronics, and communication devices. Product Features and Advantages Reworkable Design – Easy Chip Removal Unlike conventional epox...

10W High Thermal Conductivity Gel – Advanced Thermal Management for High-Power Electronics As electronic devices become smaller yet more powerful, thermal management has become a critical challenge. Excessive heat can shorten component lifespan, reduce performance, and cause system instability. The 10W High Thermal Conductivity Gel is designed to meet these demanding thermal management requirements. With an impressive thermal conductivity of 10W/m·K , it provides efficient heat transfer, excellent stability, and long-term reliability , ensuring your devices operate at peak performance even under high thermal loads. Ideal for power modules, automotive electronics, LED lighting, communication base stations, and industrial control systems , this thermal gel delivers a balance of high performance and easy application. Product Features and Advantages Exceptional Thermal Conductivity (10W/m·K) The gel offers superior heat dissipation efficiency , rapidly transferring heat from high-tem...

Low Shrinkage Epoxy Resin Adhesive – Precision Bonding for Advanced Applications In industrial manufacturing, precision and reliability define quality. When bonding materials that require high dimensional accuracy and strong adhesion , conventional adhesives often fail due to shrinkage during curing. That’s where Low Shrinkage Epoxy Resin Adhesive stands out. Engineered with advanced polymer technology, it offers exceptional bonding strength, dimensional stability, and chemical resistance —making it the ideal choice for high-performance assembly, electronics, composites, and construction applications. Whether for structural bonding, potting, encapsulation, or surface repair , this epoxy adhesive delivers consistent performance, ensuring components stay perfectly aligned and bonded under demanding conditions. Product Features and Advantages Ultra-Low Shrinkage Formula Designed with advanced epoxy and curing agents, the adhesive minimizes volumetric shrinkage during curing to less t...